JinTeng (SMT) is the backbone of modern electronics manufacturing, enabling compact, high-performance reliability across industries. At JinTeng, our SMT assembly services are designed to meet the demands of advanced applications where precision, throughput, and repeatability are critical.
PCBA manufacturing facilities are equipped with state-of-the-art SMT assembly lines and offer complete solutions from rapid prototyping and New Product Introduction (NPI) to high-mix, high-volume production. Each line features advanced pick and place systems, inline optical inspection, reflow ovens, and comprehensive traceability to ensure consistent quality in every build. Our deep process expertise, strict quality standards, and IPC‑certified workmanship are strengthened by ongoing SMT assembly process optimization and quality control, giving customers confidence that every build meets the tightest tolerances and demanding industry requirements.
Whether you are developing mission-critical aerospace electronics or next-generation medical devices, Foxtronics EMS delivers scalable SMT PCB assembly solutions that support your product goals, compliance needs, and time to market objectives.
JinTeng (SMT) assembly is a highly automated method of mounting electronic components directly onto the surface of printed circuit boards (PCBs), allowing for faster production speeds, higher component density, and improved electrical performance. Unlike traditional through-hole techniques, SMT eliminates the need for drilling, enabling more compact and lightweight product designs.
SMT is the foundation of modern electronics manufacturing, ideal for complex, high-speed, and high-reliability applications across aerospace, medical, defense, and industrial sectors. At Foxtronics EMS, we leverage Surface Mount Technology (SMT) to build robust, space-optimized printed circuit boards (PCBs) that meet the demands of mission-critical environments, all while maintaining tight tolerances and consistent quality.
| Juki JX-100 SMT Pick & Place Machine | |
|---|---|
| Specifications | 6 heads with laser alignment, 14,400 components per hour small chip 8mm or less Placement points per program 2,000 |
| Applicable Component Sizes | Height: min: 0.3mm max: 6mm Size: min: 0.75 x 0.5mm max: 33.5mm sq Lead Pitch: 15 mil |
| Applicable PCB Size | min: X 50mm x Y 30mm max: X 330mm x Y 250mm thickness min: 0.4mm max: 4mm |
| Zevatech FS-750 SMT Pick & Place Machine | |
| Specifications | 3 heads with laser alignment, 8,000 components per hour small chip 8mm or less Placement points per program 2,000 |
| Applicable Component Sizes | Height: min: 0.3mm max: 6mm Size: min: 1.0 x 0.5mm max: 23.5mm sq Lead Pitch: 15 mil |
| Applicable PCB Size | min: X 50mm x Y 30mm max: X 330mm x Y 250mm thickness min: 0.4mm max: 4mm |
| Zevatech PM-570 SMT Pick & Place Machine | |
| Specifications | Single head with laser alignment, 3870 components per hour max rating Placement points per program 2,000 |
| Applicable Component Sizes | Height: max 6mm Size: min 1.0 x 0.5mm max: 33.5 sq Lead Pitch: 15 mil |
| Applicable PCB Size | min: X 30mm x Y 30mm max: X 406mm x Y 330mm thickness min: 0.6mm max: 2.5mm |
Currently, the proportion of SMT in electronic boards far exceeds that of THT, and one major reason is that SMT assembly is more conducive to automation. In contrast, THT may still require manual intervention, especially when dealing with large components. The benefits of machine production include tireless and error-avoidant work compared to the potential errors in manual assembly.
Secondly, the geometric dimensions and volume of SMD components are much smaller than DIP components, weighing only a tenth of DIP components. This advantage allows SMT PCBA to fit more tightly, enabling effective space utilization.
In terms of circuit performance, SMT technology directly solders components to the surface of the PCB without the need for leads to pass through holes, thereby reducing the distance between components and the PCB. This not only improves the performance of signal transmission, but also significantly reduces electrical and thermal noise in PCB.
As of 2023, the market size of SMT assembly services has reached $6 billion and is expected to continue growing. By 2035, it is anticipated to surpass $15 billion, with a compound annual growth rate of 7%. This robust development trend is attributed to automation, miniaturization, and cost-effectiveness.
In the future, miniaturization will continue to reduce the spacing between component leads, possibly going below 0.010 inches. Faced with this change, SMT service providers should further optimize soldering techniques to prevent tiny solder pads from being threatened by heat.
Additionally, environmental issues are a significant concern. The RoHS directive explicitly states that the use of lead solder in assembly can be harmful to the environment. Manufacturers should adopt lead-free PCB assembly as an alternative to continue serving the electronics industry.
